Advanced Packaging IEEE Transactions on

Recent Papers/Articles

Table of contents

Volume: 33, Issue: 4

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Waveform Relaxation Time Domain Solver for Subsystem Arrays

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Volume: 33, Issue: 4

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A Thermal Simulation Process Based on Electrical Modeling for Complex Interconnect, Packaging, and 3DI Structures

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Volume: 33, Issue: 4

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A Novel High-Capacity Electromagnetic Compression Technique Based on a Direct Matrix Solution

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Volume: 33, Issue: 4

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Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions

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Volume: 33, Issue: 4

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A Markov Chain Based Hierarchical Algorithm for Fabric-Aware Capacitance Extraction

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Volume: 33, Issue: 4

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Physics-Based Gridding for Electrical Package Analysis Codes

Volume: 33, Issue: 4

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Random Rough Surface Effects on Wave Propagation in Interconnects

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Volume: 33, Issue: 4

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Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems

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Volume: 33, Issue: 4

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A Pluggable Large Core Step Index Plastic Optical Fiber With Built-In Mode Conditioners for Gigabit Ultra Short Reach Networks

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Volume: 33, Issue: 4

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Proximity Lithography in Sub-10 Micron Circuitry for Packaging Substrate

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Volume: 33, Issue: 4

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A 3-D X-Band T/R Module Package With an Anodized Aluminum Multilayer Substrate for Phased Array Radar Applications

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Volume: 33, Issue: 4

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Interfacial Design of Anisotropic Conductive Adhesive Based Interconnects Using Molecular Wires and Understanding of Their Electrical Conduction

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Volume: 33, Issue: 4

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A Homogeneous Electrically Conductive Silver Paste

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Volume: 33, Issue: 4

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Wafer-Level Vacuum Packaging of Micromachined Thermoelectric IR Sensors

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Volume: 33, Issue: 4

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