Soldering Surface Mount Technology

Recent Papers/Articles

Reflow soldering optimization by using adaptive Kriging-HDMR method

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Volume: 28

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Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering

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Volume: 27

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Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling

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Volume: 27

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Influence of assembly parameters on lead-free solder joints reliability in package-on-package (PoP) technology

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Volume: 27

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Materials and soldering challenges in lead-free package-on-package (PoP) technology

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Volume: 27

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